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LS1026ASN8P1A - NXP

Description: MPU QorIQ LS1026A RISC 64bit 1.4GHz 780-Pin FBGA Tray

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LS1026ASN8P1A - NXP PCB footprint - BGA - BGA - FBGA780
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LS1026ASN8P1A - NXP  - 3D model - BGA - FBGA780
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LS1026ASN8P1A Details

  • Manufacturer Part Number:

    LS1026ASN8P1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1026ASN8P1A Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in the LS1026A Processor Family Reference Manual (RM) and the LS1026A Thermal Design Guide. These documents provide detailed information on PCB layout, thermal design, and heat sink recommendations to ensure optimal performance and reliability.
  • To optimize power consumption and reduce heat generation, engineers can use the LS1026A's power management features, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, NXP provides power optimization guidelines and tools, such as the LS1026A Power Consumption Estimation Tool, to help designers minimize power consumption and heat generation.
  • The LS1026ASN8P1A has a built-in security engine that provides features such as secure boot, trusted execution environment, and cryptographic acceleration. NXP also provides a Secure Boot Solution for LS1026A, which includes a secure boot loader and a set of tools to help designers implement secure boot mechanisms. Additionally, NXP recommends following secure design principles and guidelines to ensure the security of LS1026A-based systems.
  • NXP provides a range of debug and troubleshooting tools, including the LS1026A Debug and Trace Module, the NXP LPC-Link2 debug probe, and the MCUXpresso IDE. These tools allow designers to debug and troubleshoot their systems using various interfaces, such as JTAG, UART, and Ethernet. Additionally, NXP provides documentation and application notes on debugging and troubleshooting techniques for LS1026A-based systems.
  • NXP provides a range of software development tools and resources, including the MCUXpresso IDE, the Yocto Project, and the Linux kernel. Additionally, NXP offers a range of software development kits (SDKs) and board support packages (BSPs) for various operating systems, including Linux, Android, and QNX. These resources provide designers with a comprehensive development environment for LS1026A-based systems.

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LS1026ASN8P1A Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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