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LS1046ASE8MQA - NXP

Description: Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.2GHz, 0 to 105C, Security enabled

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Symbol
LS1046ASE8MQA - NXP - PCB symbol
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PCB Footprints
LS1046ASE8MQA - NXP PCB footprint - BGA - BGA - SOT1653-1-1
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3D Models
LS1046ASE8MQA - NXP - 3D model - BGA - SOT1653-1-1
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LS1046ASE8MQA Details

  • Manufacturer Part Number:

    LS1046ASE8MQA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Address Bus Width:

    14

  • Boundary Scan:

    YES

  • Bus Compatibility:

    I2C, PCI, SPI, UART, USB

  • External Data Bus Width:

    64

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Terminals:

    780

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

LS1046ASE8MQA Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the core voltage (VDD_CORE) first, followed by the I/O voltage (VDD_IO). This ensures that the internal voltage regulators are properly enabled before the I/O voltage is applied.
  • The DDR memory interface on the LS1046ASE8MQA can be configured using the DDR Controller (DDRC) registers. The DDRC registers control the DDR clock, data width, and other parameters. Refer to the LS1046ASE8MQA reference manual for detailed information on configuring the DDR interface.
  • The maximum operating frequency of the LS1046ASE8MQA is 1.6 GHz. However, the actual operating frequency may vary depending on the specific use case and thermal conditions.
  • Secure boot on the LS1046ASE8MQA can be implemented using the Secure Boot ROM (SBROM) and the Boot ROM (BROM). The SBROM verifies the authenticity of the boot image, while the BROM loads the boot image into memory. Refer to the LS1046ASE8MQA security reference manual for detailed information on implementing secure boot.
  • The maximum temperature range for the LS1046ASE8MQA is -40°C to 105°C (junction temperature). However, the recommended operating temperature range is 0°C to 85°C (ambient temperature).

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LS1046ASE8MQA Overview

Use the download button to access the LS1046ASE8MQA schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS104, or try a keyword search, such as Multifunction Peripherals

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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