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LS1046ASN8MQA - NXP

Description: MPU QorIQ LS1046A RISC 64bit 1.2GHz 780-Pin FCBGA Tray

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PCB Footprints
LS1046ASN8MQA - NXP PCB footprint - BGA - BGA - SOT1653-1: FBGA780
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3D Models
LS1046ASN8MQA - NXP  - 3D model - BGA - SOT1653-1: FBGA780
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LS1046ASN8MQA Details

  • Manufacturer Part Number:

    LS1046ASN8MQA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • Address Bus Width:

    14

  • Boundary Scan:

    YES

  • Bus Compatibility:

    I2C, PCI, SPI, UART, USB

  • External Data Bus Width:

    64

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Terminals:

    780

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

LS1046ASN8MQA Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1046A Reference Manual (document number LS1046ARM) and the LS1046A Thermal Design Guide (document number LS1046ATDG). These documents provide detailed information on PCB layout, thermal design, and heat sink requirements.
  • To optimize power consumption, use the power management features of the LS1046ASN8MQA, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, use the NXP-provided power management software and tools, such as the Power Management Unit (PMU) driver and the NXP Power Management Framework.
  • The recommended settings for the DDR4 memory interface are provided in the LS1046A DDR4 Design Guide (document number LS1046ADG). This document provides detailed information on memory timing, signal integrity, and layout guidelines.
  • To ensure reliability and availability, follow the guidelines provided in the LS1046A Reliability and Availability Application Note (document number LS1046ARAA). This document provides information on environmental considerations, fault tolerance, and error correction mechanisms.
  • The LS1046ASN8MQA has a range of security features, including secure boot, trusted execution environment, and cryptographic acceleration. NXP provides a comprehensive security guide (document number LS1046ASG) that explains how to implement these features and ensure the security of your system.

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LS1046ASN8MQA Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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