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LS1046ASN8P1A - NXP

Description: Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.4GHz, 0 to 105C, Security disabled

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LS1046ASN8P1A - NXP - PCB symbol
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PCB Footprints
LS1046ASN8P1A - NXP PCB footprint - BGA - BGA - SOT1653-1-3
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3D Models
LS1046ASN8P1A - NXP - 3D model - BGA - SOT1653-1-3
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LS1046ASN8P1A Details

  • Manufacturer Part Number:

    LS1046ASN8P1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1046ASN8P1A Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1046ASN8P1A datasheet and application notes. Additionally, NXP recommends following the JEDEC standards for PCB design and thermal management.
  • To optimize power consumption, use the power management features of the LS1046ASN8P1A, such as dynamic voltage and frequency scaling, and implement power gating and clock gating in your design. Also, consider using low-power modes and optimizing your software to minimize power consumption.
  • The recommended settings for the DDR4 memory interface can be found in the LS1046ASN8P1A datasheet and application notes. Additionally, NXP provides a DDR4 memory interface design guide that provides detailed information on how to configure and optimize the DDR4 interface.
  • To ensure reliable booting and secure boot mechanisms, use the secure boot features of the LS1046ASN8P1A, such as the Boot ROM and Secure Boot mechanism. Implement a secure boot process that verifies the authenticity and integrity of the boot loader and operating system.
  • The LS1046ASN8P1A has a maximum junction temperature of 105°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB layout that allows for good airflow and heat dissipation.

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LS1046ASN8P1A Overview

Use the download button to access the LS1046ASN8P1A schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS104, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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