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LS1046ASN8T1A - NXP

Description: Microprocessors - MPU QorIQ Layerscape 4xA72 64Bit ARM-1.8G DDR4-2.1G PCIe 1/10GbE SATA USB 0-105C 23x23pkg 1.0V

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Symbol
LS1046ASN8T1A - NXP - PCB symbol
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PCB Footprints
LS1046ASN8T1A - NXP PCB footprint - BGA - BGA - SOT1653-1: FBGA780
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3D Models
LS1046ASN8T1A - NXP - 3D model - BGA - SOT1653-1: FBGA780
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LS1046ASN8T1A Details

  • Manufacturer Part Number:

    LS1046ASN8T1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1046ASN8T1A Frequently Asked Questions (FAQs)

  • NXP provides a reference design guide for the LS1046ASN8T1A, which includes recommendations for PCB layout, thermal design, and power delivery. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • To optimize power consumption, use the power management features of the LS1046ASN8T1A, such as dynamic voltage and frequency scaling, clock gating, and power gating. Additionally, optimize your software and firmware to minimize power consumption during idle periods.
  • The recommended settings for the DDR4 memory interface can be found in the LS1046ASN8T1A datasheet and the NXP-provided DDR4 calibration tool. It's essential to follow these settings to ensure reliable and high-performance memory operation.
  • NXP provides a secure boot and firmware update solution for the LS1046ASN8T1A, which includes a secure boot loader and firmware update tools. Follow the NXP-provided documentation and guidelines to implement secure boot and firmware updates.
  • The LS1046ASN8T1A has a maximum junction temperature of 105°C. Ensure proper thermal management by using a heat sink, thermal interface material, and a well-designed PCB layout to dissipate heat effectively.

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LS1046ASN8T1A Overview

Use the download button to access the LS1046ASN8T1A schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS104, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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