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LS1046AXN8P1A - NXP

Description: Microprocessors - MPU Layerscape 64-bit Arm Cortex-A72, Quad-core, 1.4GHz, -40 to 105C, Security disabled

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LS1046AXN8P1A - NXP - PCB symbol
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PCB Footprints
LS1046AXN8P1A - NXP PCB footprint - BGA - BGA - FBGA780
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3D Models
LS1046AXN8P1A - NXP - 3D model - BGA - FBGA780
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LS1046AXN8P1A Details

  • Manufacturer Part Number:

    LS1046AXN8P1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    2020-07-06

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.07 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1046AXN8P1A Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1046AXN8P1A datasheet and application notes. Additionally, NXP recommends following the JEDEC JESD51-7 and JESD51-14 standards for thermal design and PCB layout.
  • To optimize power consumption, use the power management features of the LS1046AXN8P1A, such as dynamic voltage and frequency scaling, clock gating, and power gating. Also, optimize the system design to minimize power consumption, and use low-power modes when possible.
  • The recommended settings for the DDR4 memory interface can be found in the LS1046AXN8P1A datasheet and application notes. Additionally, NXP provides a DDR4 memory interface design guide and a DDR4 calibration tool to help optimize the memory interface.
  • To ensure reliability and availability, follow NXP's guidelines for environmental testing, such as temperature, humidity, and vibration testing. Also, implement error correction mechanisms, such as ECC memory and checksums, and use redundant systems and backup power supplies when necessary.
  • The LS1046AXN8P1A has various security features, including secure boot, trusted execution environment, and cryptographic acceleration. Implement these features by following NXP's security guidelines and using the provided security software development kits (SDKs) and tools.

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LS1046AXN8P1A Overview

Use the download button to access the LS1046AXN8P1A schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LS104, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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