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LS1088ASN7Q1A - NXP

Description: MPU QorIQ LS1088A RISC 64bit 1.6GHz 780-Pin FBGA Tray

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PCB Footprints
LS1088ASN7Q1A - NXP PCB footprint - BGA - BGA - SOT1653-1
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LS1088ASN7Q1A - NXP  - 3D model - BGA - SOT1653-1
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LS1088ASN7Q1A Details

  • Manufacturer Part Number:

    LS1088ASN7Q1A

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FCBGA-780

  • ECCN Code:

    5A002.A.1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA780,28X28,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Peak Reflow Temperature (Cel):

    250

  • Seated Height-Max:

    2.61 mm

  • Supply Voltage-Max:

    1.055 V

  • Supply Voltage-Min:

    0.995 V

  • Supply Voltage-Nom:

    1.025 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

LS1088ASN7Q1A Frequently Asked Questions (FAQs)

  • NXP provides a reference design and layout guidelines in the LS1088ASN7Q1A Reference Manual (RM) and the NXP PowerQUICC III Processor Family Thermal Design Guide. Additionally, NXP recommends consulting with a thermal expert or using thermal simulation tools to ensure optimal heat dissipation.
  • To optimize power consumption, use the power management features of the LS1088ASN7Q1A, such as dynamic voltage and frequency scaling, and clock gating. Also, consider using low-power modes, like sleep or standby, when the processor is not actively processing data. NXP provides power consumption estimates and guidelines in the datasheet and RM.
  • NXP provides recommended settings for the DDR memory interface in the LS1088ASN7Q1A RM and the NXP DDR Memory Interface Application Note. For signal integrity, follow the guidelines for PCB layout, routing, and termination, and use simulation tools to analyze signal integrity. NXP also recommends using a DDR signal integrity tool, like the NXP DDR Signal Integrity Tool, to optimize the design.
  • NXP provides a Secure Boot solution for the LS1088ASN7Q1A, which includes a secure boot ROM and a secure firmware update mechanism. Consult the NXP Secure Boot Application Note and the LS1088ASN7Q1A RM for implementation details. Additionally, consider using a secure firmware update protocol, like HTTPS or secure socket layer (SSL), to ensure secure firmware updates.
  • The LS1088ASN7Q1A is designed to operate in a variety of environmental conditions, but there are limitations and considerations that must be taken into account. Consult the datasheet and RM for operating temperature ranges, vibration tolerance, and other environmental specifications. NXP also recommends consulting with a reliability expert or using environmental testing and simulation tools to ensure the design meets the required environmental specifications.

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LS1088ASN7Q1A Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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