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LSF0102DC-Q100H - Nexperia

Description: LSF0102-Q100 - 2-bit bidirectional multi-voltage level translator; open-drain;\t\t\tpush-pull@en-us

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LSF0102DC-Q100H - Nexperia PCB footprint - Small Outline Packages - Small Outline Packages - SOT765-1
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3D Models
LSF0102DC-Q100H - Nexperia  - 3D model - Small Outline Packages - SOT765-1
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LSF0102DC-Q100H Details

  • Manufacturer Part Number:

    LSF0102DC-Q100H

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    VSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT765-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LSF0102DC-Q100H Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for LSF0102DC-Q100H is a 2x2 array of 0.5mm diameter pads with a 1.5mm pitch. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure reliability in high-temperature applications, it's crucial to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using thermal vias, and keeping the device away from heat sources. Additionally, ensure that the device is operated within its recommended temperature range of -40°C to 125°C.
  • The maximum current rating for the LSF0102DC-Q100H is 2A per channel. However, it's essential to consider the power dissipation and thermal performance of the device when operating at high currents. Be sure to follow the recommended operating conditions and thermal design guidelines to ensure reliable operation.
  • Yes, the LSF0102DC-Q100H is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to ensure that the device is used within its recommended operating conditions and that the system design meets the required automotive standards and regulations.
  • To troubleshoot issues with the LSF0102DC-Q100H, start by verifying the device's operating conditions, including voltage, current, and temperature. Check for any signs of overheating, electrical overstress, or physical damage. Use oscilloscopes and other diagnostic tools to analyze the device's behavior and identify the root cause of the issue. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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LSF0102DC-Q100H Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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