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LSF0102DCH - Nexperia

Description: Translation - Voltage Levels LSF0102DC/SOT765/VSSOP8

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PCB Footprints
LSF0102DCH - Nexperia PCB footprint - Small Outline Packages - Small Outline Packages - SOT765-1_2021
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3D Models
LSF0102DCH - Nexperia  - 3D model - Small Outline Packages - SOT765-1_2021
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LSF0102DCH Details

  • Manufacturer Part Number:

    LSF0102DCH

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Package Description:

    VSSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT765-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    ALSO HAS PUSHPULL OUTPUT

  • Delay-Max:

    1.3 ns

  • Interface IC Type:

    VOLTAGE LEVEL TRANSLATOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    2.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSSOP8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Current-Max:

    64 mA

  • Supply Voltage-Max:

    5 V

  • Supply Voltage-Min:

    0.95 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

LSF0102DCH Frequently Asked Questions (FAQs)

  • Nexperia recommends a symmetrical PCB layout with a central ground plane, and to keep the input and output traces as short as possible to minimize parasitic inductance and capacitance. Additionally, it's recommended to use a solid ground plane under the device to reduce electromagnetic interference (EMI).
  • The LSF0102DCH requires a single 1.8V to 5.5V power supply, and the input and output pins should be biased to the same voltage as the power supply. It's also recommended to use a bypass capacitor between the power supply pin and ground to reduce noise and ensure stable operation.
  • The LSF0102DCH is specified to operate up to 100 MHz, but the actual operating frequency may be limited by the system design and layout. It's recommended to consult the datasheet and application notes for more information on frequency limitations and design considerations.
  • The LSF0102DCH has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, it's recommended to use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines to protect against external ESD events.
  • The LSF0102DCH has a thermal pad on the bottom of the package, which should be connected to a solid ground plane or a thermal via to dissipate heat. It's also recommended to use a thermal interface material (TIM) between the device and the PCB to improve thermal conductivity.

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LSF0102DCH Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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