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LSIC2SD120E30CC - LITTELFUSE

Description: Schottky Diodes & Rectifiers 1200V 30A TO-247-3L SiC Schottky Diode

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PCB Footprints
LSIC2SD120E30CC - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3L_2023
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3D Models
LSIC2SD120E30CC - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247-3L_2023
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LSIC2SD120E30CC Details

  • Manufacturer Part Number:

    LSIC2SD120E30CC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2018-05-30

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0.4

  • Additional Feature:

    PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.8 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    44 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Dissipation-Max:

    428 W

  • Rep Pk Reverse Voltage-Max:

    1200 V

  • Reverse Current-Max:

    100 µA

  • Reverse Test Voltage:

    1200 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

LSIC2SD120E30CC Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for LSIC2SD120E30CC is a standard SMD footprint with a pad size of 2.5mm x 1.5mm and a spacing of 1.5mm between pads. It's recommended to follow the manufacturer's recommended footprint and layout guidelines to ensure proper thermal performance and reliability.
  • While LSIC2SD120E30CC has a high junction temperature rating of 150°C, it's not recommended to operate it continuously above 125°C. Prolonged exposure to high temperatures can affect the device's reliability and lifespan. It's essential to follow the recommended operating temperature range and consider thermal management strategies to ensure reliable operation.
  • To ensure the reliability of LSIC2SD120E30CC in a high-vibration environment, it's recommended to follow proper mounting and soldering techniques, and to use a secure and robust PCB design. Additionally, consider using a vibration-resistant mounting method, such as a screw-down or clip-mount, and ensure that the device is properly secured to the PCB.
  • LSIC2SD120E30CC is designed to operate in a normal humidity environment. However, exposure to high humidity can affect the device's reliability and lifespan. It's recommended to follow proper storage and handling procedures, and to consider using a moisture-resistant coating or conformal coating to protect the device in high-humidity environments.
  • The recommended soldering profile for LSIC2SD120E30CC is a standard SMD reflow profile with a peak temperature of 260°C and a dwell time of 20-30 seconds. It's essential to follow the manufacturer's recommended soldering profile and guidelines to ensure reliable solder joints and to prevent damage to the device.

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LSIC2SD120E30CC Overview

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