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LSM6DS3HTR - STMicroelectronics

Description: STMICROELECTRONICS - LSM6DS3HTR - MEMS MODULE, 3-AXIS GYRO/ACCEL, LGA-14

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LSM6DS3HTR - STMicroelectronics - PCB symbol
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PCB Footprints
LSM6DS3HTR - STMicroelectronics PCB footprint - Other - Other - LGA-14(2.5x3x0.86)
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3D Models
LSM6DS3HTR - STMicroelectronics - 3D model - Other - LGA-14(2.5x3x0.86)
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LSM6DS3HTR Details

  • Manufacturer Part Number:

    LSM6DS3HTR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    3 X 2.50 MM, 0.83 MM HEIGHT, GREEN, PLASTIC, LGA-14

  • ECCN Code:

    EAR99

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    0

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PBGA-B14

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFLGA

  • Package Equivalence Code:

    LGA14,1X1,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    0.86 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    1.71 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BUTT

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    2.5 mm

LSM6DS3HTR Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the device with a stable voltage supply, then wait for at least 10ms before sending any commands or configuring the device.
  • The self-test feature can be enabled by setting the ST bit in the CTRL3_C register. The device will then perform a self-test and report the results in the STATUS_REG register. The self-test should be performed after power-on and before starting normal operation.
  • The FIFO buffer is used to store acceleration and angular rate data when the device is operating in FIFO mode. The buffer can store up to 4096 bytes of data, and can be used to reduce the number of interrupts generated by the device.
  • The interrupt pins can be configured by setting the INT1_CFG and INT2_CFG registers. The interrupt pins can be configured to generate interrupts on various events, such as data ready, FIFO threshold, or sensor errors.
  • The recommended calibration procedure involves performing a series of movements and rotations with the device, and then using the resulting data to calculate the sensitivity and offset values for each axis. The calibration procedure should be performed in a controlled environment with minimal vibrations and noise.

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LSM6DS3HTR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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