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LT1014ISW#PBF - Analog Devices

Description: Quad Precision Op Amp

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LT1014ISW#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - SW Package 16-Lead Plastic Small Outline
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LT1014ISW#PBF - Analog Devices  - 3D model - Small Outline Packages - SW Package 16-Lead Plastic Small Outline
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LT1014ISW#PBF Details

  • Manufacturer Part Number:

    LT1014ISW#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1620 (SW16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.038 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    97 dB

  • Common-mode Reject Ratio-Nom:

    113 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    400 µV

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -22 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.642 mm

  • Slew Rate-Min:

    0.2 V/us

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    0.5 mA

  • Supply Voltage Limit-Max:

    22 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Gain-Min:

    500000

  • Wideband:

    NO

  • Width:

    7.493 mm

LT1014ISW#PBF Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LT1014ISW#PBF is 1.4W, which is calculated based on the package thermal resistance and the maximum junction temperature.
  • To ensure stability, it's essential to follow the recommended layout and grounding techniques, use a low-ESR capacitor for decoupling, and avoid parasitic inductance in the output filter.
  • The recommended input capacitor value for the LT1014ISW#PBF is 1uF to 10uF, depending on the input voltage and output current requirements. A larger capacitor value can help reduce input ripple and improve transient response.
  • The LT1014ISW#PBF is rated for operation up to 125°C, but the maximum junction temperature should not exceed 150°C. Ensure proper heat sinking and thermal management to prevent overheating.
  • The output voltage of the LT1014ISW#PBF can be calculated using the formula: Vout = (1 + R2/R1) * Vref, where R1 and R2 are the feedback resistors, and Vref is the internal reference voltage (2.5V).

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LT1014ISW#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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