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LT1317BCMS8#PBF - Analog Devices

Description: Linear Technology LT1317BCMS8#PBF, Step Up DC-DC Converter, 200mA, Maximum of 3.3 V, 8-Pin MSOP

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LT1317BCMS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 8
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LT1317BCMS8#PBF - Analog Devices  - 3D model - Small Outline Packages - MS8 8
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LT1317BCMS8#PBF Details

  • Manufacturer Part Number:

    LT1317BCMS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    12 V

  • Input Voltage-Min:

    1.5 V

  • Input Voltage-Nom:

    2 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    1.35 A

  • Output Voltage-Nom:

    1.24 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    6.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    720 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LT1317BCMS8#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1317 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the output capacitor has a low ESR (Equivalent Series Resistance) and is properly sized for the output current. Additionally, avoid using capacitors with high ESL (Equivalent Series Inductance) as they can cause oscillations.
  • The LT1317 can operate in ambient temperatures up to 125°C, but the junction temperature should not exceed 150°C. It's essential to ensure proper heat sinking and thermal management to prevent overheating.
  • Yes, the LT1317 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured using a robust process that ensures high reliability and low defect rates.
  • To troubleshoot issues, start by verifying the input voltage, output voltage, and output current. Check for proper component values, PCB layout, and thermal management. Use an oscilloscope to check for oscillations or noise on the output. Consult the datasheet and application notes for guidance on troubleshooting common issues.

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LT1317BCMS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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