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LT1675CGN#PBF - Analog Devices

Description: Video Amplifiers 250MHz, 3x & 1x RGB Multxer w/ Amps

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LT1675CGN#PBF Details

  • Manufacturer Part Number:

    LT1675CGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE,PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    VIDEO MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.89 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -6 V

  • Neg Supply Voltage-Min (Vsup):

    -4 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Normal Position:

    NC

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    4 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    100 ns

  • Switch-on Time-Max:

    10 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.5 mm

LT1675CGN#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1675CGN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability in high-gain configurations, it's essential to follow the recommended compensation network values and to use a low-ESR output capacitor. Additionally, the input and output resistors should be chosen to minimize phase shift and ensure a stable gain margin.
  • The maximum power dissipation of the LT1675CGN is dependent on the package type and the ambient temperature. For the GN package, the maximum power dissipation is approximately 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the actual operating conditions.
  • The LT1675CGN is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. It's recommended to consult the datasheet and to perform thorough testing to ensure the device meets the required specifications in the target application.
  • The LT1675CGN has an internal input clamp that protects the device from input voltages up to 7V. However, it's recommended to add external protection circuitry, such as a voltage clamp or a transient voltage suppressor, to protect the device from higher input voltages or transients.

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LT1675CGN#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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