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LT1725IS#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LT1725IS#PBF - CONTROLLER, ISOLATD, FLYBACK, 16SOIC

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LT1725IS#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S Package 16-Lead Plastic Small Outline (Narrow .150 Inch)
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LT1725IS#PBF - Analog Devices  - 3D model - Small Outline Packages - S Package 16-Lead Plastic Small Outline (Narrow .150 Inch)
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LT1725IS#PBF Details

  • Manufacturer Part Number:

    LT1725IS#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1610 (S16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    11 V

  • Input Voltage-Nom:

    14 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.906 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.752 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    125 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LT1725IS#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1725IS involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability in high-gain configurations, it's essential to follow proper compensation techniques, such as adding a capacitor in parallel with the feedback resistor or using a zero-pin compensation network. Additionally, ensure that the output impedance of the device is low enough to drive the load.
  • The maximum power dissipation of the LT1725IS is dependent on the package type and the ambient temperature. The maximum power dissipation can be calculated using the formula: Pd = (VIN - VOUT) x IOUT. It's essential to ensure that the device does not exceed the maximum junction temperature of 150°C.
  • The LT1725IS is rated for operation up to 125°C, but the device's performance may degrade at high temperatures. It's essential to derate the device's power dissipation and ensure that the junction temperature does not exceed 150°C. Additionally, the device's accuracy and stability may be affected at high temperatures.
  • To protect the LT1725IS from overvoltage and overcurrent conditions, it's recommended to use voltage clamps, such as zener diodes or transient voltage suppressors, on the input and output pins. Additionally, consider using current-limiting resistors or fuses to prevent excessive current draw.

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LT1725IS#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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