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LT1766EGN#PBF - Analog Devices

Description: Linear Technology LT1766EGN#PBF, Step Down DC-DC Converter, 1.5A, 16-Pin SSOP

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LT1766EGN#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - GN Package 16-Lead Plastic SSOP-ren1
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LT1766EGN#PBF - Analog Devices  - 3D model - Small Outline Packages - GN Package 16-Lead Plastic SSOP-ren1
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LT1766EGN#PBF Details

  • Manufacturer Part Number:

    LT1766EGN#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.150 INCH, LEAD FREE, PLASTIC, SSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1641 (GN16)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    5.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.8895 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    4.2 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    228 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.635 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LT1766EGN#PBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the LT1766EGN is 15V, but it's recommended to operate within the specified input voltage range of 3.6V to 15V for optimal performance and reliability.
  • To ensure stability in the output voltage, it's essential to follow the recommended layout and component selection guidelines, including the use of a suitable output capacitor and a low-ESR input capacitor. Additionally, ensure that the input voltage is within the specified range and that the device is operated within its recommended operating conditions.
  • The maximum output current that the LT1766EGN can deliver is 3A, but it's recommended to operate within the specified output current range of 0A to 3A for optimal performance and reliability.
  • To protect the LT1766EGN from overheating, ensure that the device is operated within its recommended operating temperature range of -40°C to 125°C, and that the thermal pad is properly connected to a heat sink or a thermal interface material. Additionally, ensure that the device is not exposed to excessive ambient temperatures or power dissipation.
  • The recommended PCB layout for the LT1766EGN involves placing the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the input and output traces. It's also essential to follow the recommended component placement and routing guidelines to minimize noise and ensure optimal performance.

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LT1766EGN#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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