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LT1962IMS8#TRPBF - Analog Devices

Description: LDO Regulator Pos 1.22V to 20V 0.3A Automotive 8-Pin MSOP T/R

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LT1962IMS8#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP
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LT1962IMS8#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP
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LT1962IMS8#TRPBF Details

  • Manufacturer Part Number:

    LT1962IMS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.43 V

  • Dropout Voltage1-Nom:

    0.27 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.0222

  • Load Regulation-Max(%):

    0.98%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    20 V

  • Output Voltage1-Min:

    1.22 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LT1962IMS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1962IMS8#TRPBF should include a solid ground plane, wide power traces, and a thermal relief pattern under the package to facilitate heat dissipation. A 4-layer board with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, it's essential to follow the recommended output capacitor selection and layout guidelines. A minimum output capacitance of 10uF with an ESR of 0.1 ohms or less is recommended. Additionally, the output capacitor should be placed close to the output pin, and the feedback network should be connected close to the output capacitor.
  • The maximum ambient temperature for reliable operation of the LT1962IMS8#TRPBF is 85°C. However, the device can operate up to 125°C junction temperature. It's essential to ensure proper thermal management to prevent overheating.
  • Yes, the LT1962IMS8#TRPBF is suitable for high-reliability applications. It's manufactured using a high-reliability process, and it's qualified to automotive and industrial standards. However, it's essential to follow proper design and manufacturing guidelines to ensure the required level of reliability.
  • To protect the LT1962IMS8#TRPBF from overvoltage and overcurrent conditions, it's recommended to use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it exceeds the recommended maximum rating. Additionally, a current sense resistor and a fuse can be used to detect and respond to overcurrent conditions.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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