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LT1964ES5-5#TRMPBF - Analog Devices

Description: LT1964ES5-5#TRMPBF, Low Noise LDO Voltage Regulator, 0.2A, -5 V, 0 → 40 Vin, 5-Pin TSOT-23

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LT1964ES5-5#TRMPBF - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5 Lead Plastic TSOT-23
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LT1964ES5-5#TRMPBF - Analog Devices  - 3D model - SOT23 (5-Pin) - 5 Lead Plastic TSOT-23
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LT1964ES5-5#TRMPBF Details

  • Manufacturer Part Number:

    LT1964ES5-5#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MO-193, TSOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    05-08-1635

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.49 V

  • Dropout Voltage1-Nom:

    0.34 V

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    5.5 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Load Regulation-Max:

    0.05%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    5.15 V

  • Output Voltage1-Min:

    4.85 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED NEGATIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.625 mm

LT1964ES5-5#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1964ES5-5 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI.
  • To ensure stability, ensure that the output capacitor is properly sized, the input voltage is within the recommended range, and the device is operated within its specified temperature range. Additionally, adding a small capacitor (e.g., 10nF) between the output and ground can help prevent oscillations.
  • The LT1964ES5-5 can deliver up to 5A of output current, but this is dependent on the input voltage, output voltage, and ambient temperature. Refer to the datasheet for specific current limits and thermal derating information.
  • Use overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the device. OVP can be implemented using a voltage supervisor or a zener diode, while OCP can be implemented using a current sense resistor and a comparator.
  • The thermal resistance of the LT1964ES5-5 package is typically around 25°C/W (junction-to-ambient) and 10°C/W (junction-to-case). This information is usually provided in the datasheet or can be obtained from the manufacturer.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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