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LT1990IMS8-10#PBF - Analog Devices

Description: SP Amp Difference Amplifier Single R-R O/P ±18V/36V 8-Pin MSOP Tube

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LT1990IMS8-10#PBF Details

  • Manufacturer Part Number:

    LT1990IMS8-10#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    72 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    4500 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -36 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.4 V/us

  • Slew Rate-Nom:

    1.2 V/us

  • Supply Current-Max:

    0.375 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Wideband:

    NO

  • Width:

    3 mm

LT1990IMS8-10#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1990 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a low-ESR output capacitor, and keep the input and output capacitors close to the device. Also, avoid using long input traces and minimize the area of the input and output loops.
  • The maximum power dissipation of the LT1990 is dependent on the package and the ambient temperature. For the IMS8 package, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the package.
  • While the LT1990 can be used as a voltage regulator, it's not recommended due to its limited output current capability and lack of short-circuit protection. The LT1990 is primarily designed as a high-speed, low-noise amplifier, and using it as a voltage regulator may compromise its performance and reliability.
  • To protect the LT1990 from overvoltage and ESD, use a voltage clamp or a transient voltage suppressor (TVS) at the input, and ensure that the input voltage does not exceed the maximum rating. Also, follow proper ESD handling procedures during assembly and testing.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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