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LT1997HDF-2#PBF - Analog Devices

Description: General Purpose Amplifier 1 Circuit Rail-to-Rail 14-DFN (4x4) , 20 µV , -40°C ~ 125°C

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LT1997HDF-2#PBF - Analog Devices - PCB symbol
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PCB Footprints
LT1997HDF-2#PBF - Analog Devices PCB footprint - Other - Other - DF Package 14(12)-Lead Plastic DFN (4mm × 4mm)_2025-1
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LT1997HDF-2#PBF - Analog Devices - 3D model - Other - DF Package 14(12)-Lead Plastic DFN (4mm × 4mm)_2025-1
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LT1997HDF-2#PBF Details

  • Manufacturer Part Number:

    LT1997HDF-2#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-14/12

  • Pin Count:

    14

  • Manufacturer Package Code:

    05-08-1963

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    2018-06-19

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.015 µA

  • Bias Current-Max (IIB) @25C:

    0.005 µA

  • Common-mode Reject Ratio-Min:

    101 dB

  • Common-mode Reject Ratio-Nom:

    118 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    200 µV

  • JESD-30 Code:

    S-PDSO-N12

  • Length:

    4 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -30 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    YES

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Min:

    0.45 V/us

  • Slew Rate-Nom:

    0.75 V/us

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage Limit-Max:

    30 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Wideband:

    NO

  • Width:

    4 mm

LT1997HDF-2#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1997HDF-2#PBF involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended PCB layout, use the correct output capacitor value, and ensure that the input and output impedance are matched. Additionally, adding a small resistor (e.g., 10Ω) in series with the output can help dampen oscillations.
  • The maximum power dissipation of the LT1997HDF-2#PBF is dependent on the ambient temperature and the thermal resistance of the package. The maximum power dissipation can be calculated using the formula: Pd = (TJ - TA) / θJA, where Pd is the power dissipation, TJ is the junction temperature, TA is the ambient temperature, and θJA is the thermal resistance.
  • The LT1997HDF-2#PBF is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It's essential to consider the device's thermal characteristics and ensure proper heat sinking and cooling to maintain reliable operation.
  • To protect the LT1997HDF-2#PBF from overvoltage and overcurrent conditions, consider adding overvoltage protection (OVP) and overcurrent protection (OCP) circuits. OVP can be achieved using a voltage clamp or a zener diode, while OCP can be achieved using a current sense resistor and a comparator.

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LT1997HDF-2#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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