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LT3048IDC#TRPBF - Analog Devices

Description: Voltage Generator 8-Pin DFN EP T/R

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LT3048IDC#TRPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DC8 Package 8-Lead Plastic DFN (2mm × 2mm)
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3D Models
LT3048IDC#TRPBF - Analog Devices  - 3D model - Small Outline No-lead - DC8 Package 8-Lead Plastic DFN (2mm × 2mm)
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LT3048IDC#TRPBF Details

  • Manufacturer Part Number:

    LT3048IDC#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1939

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Additional Feature:

    SEATED HT-CALCULATED

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Input Voltage-Max:

    4.8 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,18

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    1300 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

LT3048IDC#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3048IDC#TRPBF involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability and prevent oscillations, it's essential to follow the recommended capacitor values and types, keep the input and output capacitors close to the device, and avoid using capacitors with high ESR values. Additionally, adding a small ceramic capacitor (e.g., 10nF) between the VOUT and GND pins can help improve stability.
  • The maximum input voltage that can be applied to the LT3048IDC#TRPBF is 15V, but it's recommended to operate the device within the specified input voltage range (3.1V to 15V) to ensure optimal performance and reliability.
  • The LT3048IDC#TRPBF is rated for operation up to 125°C, but it's essential to consider the device's thermal characteristics and ensure that the junction temperature (TJ) does not exceed 150°C. Proper thermal design, including heat sinking and airflow, is crucial for high-temperature operation.
  • The output voltage accuracy and tolerance can be calculated using the formula: VOUT = VREF x (1 + (R1/R2)), where VREF is the internal reference voltage (2.048V), and R1 and R2 are the resistors used to set the output voltage. The tolerance of the output voltage is determined by the tolerance of the resistors and the internal reference voltage.

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LT3048IDC#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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