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LT3061HDCB#TRMPBF - Analog Devices

Description: LDO Voltage Regulators 45v Vin, Micropower, Low Noise 100mA LDO with Output Discharge

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LT3061HDCB#TRMPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DCB Package 8-Lead Plastic DFN (2mm × 3mm)+
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LT3061HDCB#TRMPBF - Analog Devices  - 3D model - Small Outline No-lead - DCB Package 8-Lead Plastic DFN (2mm × 3mm)+
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LT3061HDCB#TRMPBF Details

  • Manufacturer Part Number:

    LT3061HDCB#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1718

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.43 V

  • Dropout Voltage1-Nom:

    0.25 V

  • Input-Output Voltage Differential-Max:

    44.4 V

  • Input-Output Voltage Differential-Min:

    1.5 V

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max (%/V):

    0.02331

  • Load Regulation-Max(%):

    0.5625%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.1 A

  • Output Voltage1-Max:

    19 V

  • Output Voltage1-Min:

    0.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,18

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

LT3061HDCB#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3061 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the output capacitor has a low ESR and is properly sized for the output current. A minimum output capacitance of 10uF is recommended. Also, avoid using ceramic capacitors with high ESL values.
  • The maximum input voltage of the LT3061 is 36V, but it's recommended to operate the device within the specified input voltage range of 2.3V to 36V for optimal performance and reliability.
  • The LT3061 is rated for operation from -40°C to 125°C, but the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and ensure proper thermal management to prevent overheating.
  • The output voltage of the LT3061 can be calculated using the formula: VOUT = VREF x (1 + R1/R2), where VREF is the internal reference voltage (1.2V), R1 is the feedback resistor, and R2 is the divider resistor. The output voltage range is from 0.8V to 15V.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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