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LT3062IDCB-3.3#TRMPBF - Analog Devices

Description: LDO Voltage Regulators 45V Vin, Micropower, Low Noise, 200mA LDO with Output Discharge

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LT3062IDCB-3.3#TRMPBF - Analog Devices - PCB symbol
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PCB Footprints
LT3062IDCB-3.3#TRMPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - LT3062IDCB-3.3#TRMPBF
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LT3062IDCB-3.3#TRMPBF - Analog Devices - 3D model - Small Outline No-lead - LT3062IDCB-3.3#TRMPBF
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LT3062IDCB-3.3#TRMPBF Details

  • Manufacturer Part Number:

    LT3062IDCB-3.3#TRMPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.53 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    50 V

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    3.9 V

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Line Regulation-Max:

    0.022%

  • Load Regulation-Max:

    0.028%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.2 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,18

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tolerance-Max:

    2%

  • Width:

    2 mm

LT3062IDCB-3.3#TRMPBF Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the LT3062IDCB-3.3 can be found in the LT3062 demo circuit DC1553A, which is available on the Analog Devices website. This layout provides a good starting point for designing a PCB that minimizes noise and ensures optimal performance.
  • The output capacitor selection depends on the output voltage, output current, and desired transient response. A general guideline is to use a low-ESR ceramic capacitor with a value between 10uF to 22uF. The datasheet provides more detailed guidance on output capacitor selection.
  • The maximum input voltage for the LT3062IDCB-3.3 is 15V. Exceeding this voltage can cause damage to the device. It's essential to ensure that the input voltage is within the recommended range to ensure reliable operation.
  • The LT3062IDCB-3.3 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's essential to consider the thermal management and ensure that the device is operated within its recommended temperature range.
  • To ensure stability, follow the recommended PCB layout, use a low-ESR output capacitor, and ensure that the input and output capacitors are properly decoupled. Additionally, the datasheet provides guidance on stability analysis and compensation techniques.

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LT3062IDCB-3.3#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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