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LT3596EUHG#PBF - Analog Devices

Description: LED Lighting Drivers 60V Step-Down LED Driver

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LT3596EUHG#PBF Details

  • Manufacturer Part Number:

    LT3596EUHG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5 X 8 MM, LEAD FREE, PLASTIC, QFN-52

  • Pin Count:

    39

  • Manufacturer Package Code:

    05-08-1846

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PQCC-N52

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    3

  • Number of Terminals:

    52

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC39/52,.2X.3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    55 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    24 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • fmax-Min:

    1 MHz

LT3596EUHG#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device on a solid copper plane, using thermal vias to connect the plane to the device's thermal pad, and keeping the plane as close to the device as possible. Additionally, using a 4-layer board with a dedicated thermal layer can help to dissipate heat more efficiently.
  • To ensure reliable startup and shutdown, it's essential to follow the recommended power sequencing and timing guidelines outlined in the datasheet. Additionally, using a soft-start circuit and a voltage supervisor can help to prevent damage to the device and ensure a smooth startup and shutdown process.
  • When selecting input and output capacitors, consider the voltage rating, capacitance value, and equivalent series resistance (ESR). The input capacitor should be able to handle the input voltage and ripple current, while the output capacitor should be able to handle the output voltage and ripple current. A low ESR is also essential to minimize energy losses and ensure stable operation.
  • To optimize the device for low noise and high power supply rejection ratio (PSRR), use a low-noise input voltage source, add a noise filter to the input, and use a high-quality output capacitor with low ESR. Additionally, consider using a shielded inductor and placing the device away from noise sources to minimize electromagnetic interference (EMI).
  • For high-power applications, thermal design considerations include using a heat sink with a high thermal conductivity, ensuring good thermal contact between the device and the heat sink, and providing adequate airflow to dissipate heat. Additionally, consider using a thermally enhanced package and a thermal interface material to further improve heat dissipation.

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LT3596EUHG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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