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LT3760EFE#PBF - Analog Devices

Description: Linear Technology LT3760EFE#PBF, LED Display Driver, 6 → 40 V, 28-Pin TSSOP

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LT3760EFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package - 28-Lead Plastic TSSOP (4.4mm)_2020
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LT3760EFE#PBF - Analog Devices  - 3D model - Small Outline Packages - FE Package - 28-Lead Plastic TSSOP (4.4mm)_2020
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LT3760EFE#PBF Details

  • Manufacturer Part Number:

    LT3760EFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    4.40 MM, LEAD FREE, PLASTIC, TSSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1663 (EB)

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Data Input Mode:

    SERIAL

  • Display Mode:

    BAR GRAPH

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    8

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    40 V

  • Supply Voltage-Min:

    6 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

  • fmax-Min:

    1.1 MHz

LT3760EFE#PBF Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short, wide traces for the high-current paths.
  • Ensure that the output voltage is within the recommended range, and the input voltage is above the minimum required voltage. Also, use a sufficient output capacitor with a low ESR, and add a small ceramic capacitor in parallel with the output capacitor to improve stability.
  • The maximum ambient temperature range for the LT3760EFE#PBF is -40°C to 125°C. However, the device's performance may degrade at higher temperatures, so it's essential to ensure proper thermal management in your design.
  • Yes, the LT3760EFE#PBF is suitable for high-reliability applications. It's manufactured using a high-reliability process, and it's qualified to automotive and industrial standards. However, it's essential to follow proper design and manufacturing practices to ensure the reliability of your final product.
  • Start by checking the input voltage, output voltage, and current. Verify that the input voltage is within the recommended range, and the output voltage is within the specified tolerance. Check for any signs of overheating, and ensure that the device is properly soldered and connected. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines.

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LT3760EFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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