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LT3964EUHE#TRPBF - Analog Devices

Description: LED Driver IC 2 Output DC DC Controller Step-Down (Buck) I2C, PWM Dimming 1.6A 36-QFN (5x6)

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LT3964EUHE#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UHE Package 36-Lead Plastic QFN (5mm × 6mm)
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LT3964EUHE#TRPBF - Analog Devices  - 3D model - Quad Flat No-Lead - UHE Package 36-Lead Plastic QFN (5mm × 6mm)
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LT3964EUHE#TRPBF Details

  • Manufacturer Part Number:

    LT3964EUHE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-36

  • Pin Count:

    36

  • Manufacturer Package Code:

    05-08-1876

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Data Input Mode:

    SERIAL

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PQCC-N36

  • JESD-609 Code:

    e3

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    4

  • Number of Terminals:

    36

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC36,.2X.24,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    12 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

  • fmax-Min:

    0.4 MHz

LT3964EUHE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT3964EUHE involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. Additionally, it's recommended to use a separate analog ground plane and to keep the analog and digital grounds separate.
  • To ensure stability, it's essential to follow the recommended component values and PCB layout guidelines. Additionally, the output capacitor should be chosen to ensure that the output impedance is low enough to prevent oscillations. It's also recommended to add a small ceramic capacitor (e.g., 10nF) between the VOUT and GND pins to improve stability.
  • The maximum input voltage that the LT3964EUHE can handle is 42V. Exceeding this voltage can cause damage to the device. It's recommended to add input voltage protection, such as a voltage clamp or a TVS diode, to prevent overvoltage conditions.
  • The LT3964EUHE is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the output current and voltage according to the temperature derating curves provided in the datasheet.
  • The output voltage ripple of the LT3964EUHE can be calculated using the formula: ΔVOUT = (IOUT * ESL) / (COUT * fSW), where ESL is the equivalent series inductance of the output capacitor, COUT is the output capacitance, and fSW is the switching frequency. The output voltage ripple should be minimized to ensure reliable operation of the downstream circuitry.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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