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LT5400ACMS8E-5#PBF - Analog Devices

Description: Resistor Networks & Arrays Matched Resistor Network, Dual 1M/1M

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LT5400ACMS8E-5#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
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LT5400ACMS8E-5#PBF - Analog Devices  - 3D model - Small Outline Packages - MS8E Package 8-Lead Plastic MSOP, Exposed Die Pad
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LT5400ACMS8E-5#PBF Details

  • Manufacturer Part Number:

    LT5400ACMS8E-5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1662

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Element Power Dissipation:

    0.8 W

  • First Element Resistance:

    1000000 Ω

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Network Type:

    ISOLATED

  • Number of Elements:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Resistor Type:

    ARRAY/NETWORK RESISTOR

  • Second/Last Element Resistance:

    1000000 Ω

  • Size Code:

    1212

  • Surface Mount:

    YES

  • Temperature Coefficient:

    25 ppm/°C

  • Temperature Coefficient Tracking:

    1 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Shape:

    GULL WING

  • Tolerance:

    7.5%

  • Working Voltage:

    75 V

LT5400ACMS8E-5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT5400 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal design and layout guidelines. This includes providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device away from heat sources. Additionally, consider using a thermally enhanced package or a heat sink to reduce the junction temperature.
  • To minimize EMI emissions, use a shielded enclosure, keep the input and output cables short and away from each other, and use ferrite beads or common-mode chokes on the input and output lines. Additionally, consider using a spread spectrum clock or a clock frequency that is not a harmonic of the switching frequency.
  • Yes, the LT5400 can be used in redundant or fault-tolerant systems. However, it's essential to ensure that the devices are properly synchronized and that the system is designed to handle the failure of one or more devices. Consider using a redundant power supply architecture and implementing fault detection and isolation mechanisms.
  • To troubleshoot issues with the LT5400, start by checking the PCB layout and ensuring that it meets the recommended guidelines. Verify that the input and output capacitors are properly selected and placed. Use an oscilloscope to measure the input and output waveforms and check for signs of oscillation or instability. Consult the datasheet and application notes for troubleshooting guidelines and consider seeking support from Analog Devices Inc.

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LT5400ACMS8E-5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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