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LT7200SAV#TRPBF - Analog Devices

Description: Buck Switching Regulator IC Positive Adjustable 0.5V 4 Output 5A, 5A, 5A, 5A 48-PowerTFQFN -40°C ~ 125°C Surface Mount

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LT7200SAV#TRPBF - Analog Devices - PCB symbol
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PCB Footprints
LT7200SAV#TRPBF - Analog Devices PCB footprint - Other - Other - LQFN Package 48-Lead (5mm x 6mm x 1.02mm)_2026
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3D Models
LT7200SAV#TRPBF - Analog Devices - 3D model - Other - LQFN Package 48-Lead (5mm x 6mm x 1.02mm)_2026
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LT7200SAV#TRPBF Details

  • Manufacturer Part Number:

    LT7200SAV#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    LFCSP:LEADFRM CHIP SCALE

  • Package Description:

    LQFN-48

  • Pin Count:

    48

  • Manufacturer Package Code:

    LFCSP:LEADFRM CHIP SCALE

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2022-11-03

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    SILENT SWITCHER

  • Input Voltage-Max:

    18 V

  • Input Voltage-Min:

    1.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XQCC-N48

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5 A

  • Output Voltage-Max:

    16.2 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    QCCN

  • Package Equivalence Code:

    LCC48,.2X.24,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.11 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

LT7200SAV#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT7200 involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a low-ESR output capacitor, and keep the input and output capacitors close to the device. Also, avoid using long input traces and ensure the device is properly decoupled.
  • The maximum input voltage that can be applied to the LT7200 is 42V, but it's recommended to keep the input voltage below 36V to ensure reliable operation and to prevent damage to the device.
  • The LT7200 is rated for operation up to 125°C, but its performance may degrade at high temperatures. It's recommended to derate the output current and voltage at high temperatures to ensure reliable operation.
  • To troubleshoot issues with the LT7200, start by checking the input voltage, output voltage, and output current. Verify that the device is properly decoupled and that the compensation network is correct. Use an oscilloscope to check for oscillations or ringing on the output. Consult the datasheet and application notes for more troubleshooting tips.

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LT7200SAV#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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