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LT8300ES5#PBF - Analog Devices

Description: IC REG FLYBACK ISO ADJ TSOT23-5

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LT8300ES5#PBF - Analog Devices - PCB symbol
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PCB Footprints
LT8300ES5#PBF - Analog Devices PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5 Lead Plastic TSOT-23
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LT8300ES5#PBF - Analog Devices - 3D model - SOT23 (5-Pin) - 5 Lead Plastic TSOT-23
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LT8300ES5#PBF Details

  • Manufacturer Part Number:

    LT8300ES5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TSOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    05-08-1635

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    100 V

  • Input Voltage-Min:

    6 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.292 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    780 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.625 mm

LT8300ES5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8300ES5 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors have low ESR and are placed close to the device. Additionally, the device's feedback loop should be properly compensated to prevent oscillations.
  • The LT8300ES5 can operate in ambient temperatures up to 125°C, but the device's junction temperature should not exceed 150°C. Proper thermal management, such as heat sinking and airflow, is necessary to ensure reliable operation.
  • Yes, the LT8300ES5 is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly soldered and the PCB is securely fastened to prevent mechanical stress. Additionally, the device's pins should be properly supported to prevent bending or flexing.
  • To troubleshoot issues, start by verifying the device's input and output voltages, and checking for proper component values and PCB layout. Use an oscilloscope to check for oscillations or noise on the output. Also, ensure that the device is properly powered and that the input voltage is within the recommended range.

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LT8300ES5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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