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LT8302IS8E#PBF - Analog Devices

Description: Linear Technology LT8302IS8E#PBF, 1-Channel, Isolated Flyback DC-DC Converter, Adjustable 8-Pin, SOIC

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LT8302IS8E#PBF - Analog Devices - PCB symbol
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LT8302IS8E#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - S8E Package
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LT8302IS8E#PBF - Analog Devices - 3D model - Small Outline Packages - S8E Package
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LT8302IS8E#PBF Details

  • Manufacturer Part Number:

    LT8302IS8E#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1857

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    8.5

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9025 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5.4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.752 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    380 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.899 mm

LT8302IS8E#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8302IS8E#PBF involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. Additionally, it's recommended to use a separate analog ground plane and to keep the power supply traces away from the analog signals.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. It's also important to decouple the power supply lines and to use a low-impedance output capacitor.
  • The maximum ambient temperature range for the LT8302IS8E#PBF is -40°C to 125°C. However, the device can operate at a junction temperature of up to 150°C.
  • Yes, the LT8302IS8E#PBF is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is suitable for use in harsh environments.
  • To troubleshoot issues with the LT8302IS8E#PBF, start by checking the power supply voltage and ensuring that it is within the recommended range. Next, verify that the input and output capacitors are properly connected and of high quality. Use an oscilloscope to check for noise and oscillations on the output. If the issue persists, consult the datasheet and application notes for further guidance.

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LT8302IS8E#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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