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LT8390AEUFD#TRPBF - Analog Devices

Description: Switching Voltage Regulators 60V 2MHz Sync 4-Switch Buck-Boost Cntr w

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LT8390AEUFD#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UFD  28-Lead Plastic QFN (4mm × 5mm)
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LT8390AEUFD#TRPBF - Analog Devices  - 3D model - Quad Flat No-Lead - UFD  28-Lead Plastic QFN (4mm × 5mm)
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LT8390AEUFD#TRPBF Details

  • Manufacturer Part Number:

    LT8390AEUFD#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    05-08-1712

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    SEATED HT-CALCULATED

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PQCC-N28

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    60 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2100 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

LT8390AEUFD#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the LT8390's performance. Analog Devices recommends a 4-layer board with a solid ground plane, and to keep the input and output capacitors close to the IC. A demo board is available from Analog Devices, which can serve as a reference design.
  • The input capacitor should have a low ESR and be able to handle the input ripple current. A 10uF to 22uF ceramic capacitor is recommended. The output capacitor should be chosen based on the output voltage and current requirements. A 22uF to 47uF ceramic capacitor is recommended for most applications.
  • The LT8390 is rated for operation up to 125°C junction temperature. However, the maximum ambient temperature depends on the specific application and the thermal design of the system. A good thermal design should ensure that the junction temperature remains below 125°C for reliable operation.
  • Analog Devices provides a troubleshooting guide in the datasheet, which covers common issues such as output voltage errors, oscillations, and overcurrent faults. Additionally, engineers can use tools such as oscilloscopes and current probes to debug the circuit.
  • Yes, the LT8390 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is available in a variety of grades, including the 'H' grade for high-reliability applications.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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