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LT8415EDDB#TRMPBF - Analog Devices

Description: Boost Switching Regulator IC Positive Adjustable 1.235V 1 Output 20mA (Switch) 12-WFDFN Exposed Pad

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LT8415EDDB#TRMPBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DDB Package 12-Lead Plastic DFN (3mm × 2mm)
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LT8415EDDB#TRMPBF - Analog Devices  - 3D model - Small Outline No-lead - DDB Package 12-Lead Plastic DFN (3mm × 2mm)
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LT8415EDDB#TRMPBF Details

  • Manufacturer Part Number:

    LT8415EDDB#TRMPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    3 X 2 MM, LEAD FREE, PLASTIC, DFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1723

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    2.5 V

  • Input Voltage-Nom:

    3 V

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Output Current-Max:

    0.03 A

  • Output Voltage-Max:

    40 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.45 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

LT8415EDDB#TRMPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT8415EDDB involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing the length of the traces between the device and the capacitors. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors meet the recommended specifications, and that the device is operated within its recommended operating conditions.
  • The LT8415EDDB can operate in ambient temperatures up to 125°C, but the device's junction temperature should not exceed 150°C. Proper thermal management, such as heat sinking and airflow, is recommended to ensure reliable operation.
  • Yes, the LT8415EDDB is designed to withstand high-vibration environments. However, it's recommended to follow proper PCB mounting and assembly techniques to ensure that the device is securely attached to the PCB and can withstand the expected vibration levels.
  • To troubleshoot issues, start by verifying that the device is properly powered and that the input and output voltages are within the recommended specifications. Check for proper PCB layout and component values, and ensure that the device is operated within its recommended operating conditions. Use oscilloscopes and other diagnostic tools to identify any issues with the device or the surrounding circuitry.

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LT8415EDDB#TRMPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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