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LTC1250CS8#PBF - Analog Devices

Description: Precision Amplifiers Very L N Zero-Drift Bridge Amp

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LTC1250CS8#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - (SO-8)
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LTC1250CS8#PBF Details

  • Manufacturer Part Number:

    LTC1250CS8#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1610 (S8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00045 µA

  • Bias Current-Max (IIB) @25C:

    0.0002 µA

  • Common-mode Reject Ratio-Min:

    110 dB

  • Common-mode Reject Ratio-Nom:

    130 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    10000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -9 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    10 V/us

  • Supply Current-Max:

    5 mA

  • Supply Voltage Limit-Max:

    9 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    1778279.41

  • Wideband:

    NO

  • Width:

    3.9 mm

LTC1250CS8#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC1250CS8#PBF involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a low-ESR capacitor for the VCC bypass and to keep the input and output traces short and direct.
  • To ensure the LTC1250CS8#PBF operates within its specified temperature range, it's essential to provide adequate heat sinking, especially in high-power applications. The device should be mounted on a PCB with a thermal relief pattern, and a heat sink can be attached to the package if necessary. Additionally, the device should be operated in an environment with good air circulation.
  • When selecting input and output capacitors for the LTC1250CS8#PBF, consider the capacitor's equivalent series resistance (ESR), voltage rating, and capacitance value. The input capacitor should have a low ESR and a high capacitance value to filter out high-frequency noise, while the output capacitor should have a low ESR and a capacitance value that meets the required output ripple specification.
  • To troubleshoot issues with the LTC1250CS8#PBF, start by verifying the device's pin connections and ensuring that the input and output capacitors are properly selected. Check the device's operating conditions, such as the input voltage and output load, to ensure they are within the specified range. Use an oscilloscope to observe the device's output waveform and look for signs of oscillation or instability. If the issue persists, consult the datasheet and application notes for guidance.
  • When designing a PCB for the LTC1250CS8#PBF, consider the following key factors: keep the analog and digital grounds separate, use a solid ground plane, and place the device close to the analog signal sources. Additionally, use a low-impedance path for the input and output traces, and avoid routing digital signals near the analog signals. Finally, ensure that the PCB has adequate thermal relief and heat sinking.

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LTC1250CS8#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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