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LTC2067IMS8#TRPBF - Analog Devices

Description: Operational Amplifiers - Op Amps 10uA Supply,LowIBIAS ZeroDrift Dual OpAmp

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LTC2067IMS8#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660 Rev G)
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LTC2067IMS8#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MS8 Package 8-Lead Plastic MSOP (Reference LTC DWG # 05-08-1660 Rev G)
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LTC2067IMS8#TRPBF Details

  • Manufacturer Part Number:

    LTC2067IMS8#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1660

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00005 µA

  • Bias Current-Max (IIB) @25C:

    0.000035 µA

  • Common-mode Reject Ratio-Min:

    103 dB

  • Common-mode Reject Ratio-Nom:

    123 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    10 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    17500 V/us

  • Supply Current-Max:

    0.025 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    100

  • Voltage Gain-Min:

    398107

  • Wideband:

    NO

  • Width:

    3 mm

LTC2067IMS8#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC2067IMS8#TRPBF involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing noise coupling between the input and output stages. A 4-layer PCB with a dedicated analog ground layer is recommended. Additionally, place the input capacitors close to the IC and use short, direct traces to minimize parasitic inductance.
  • To ensure accurate voltage regulation, make sure to follow the recommended input and output capacitor values and types, and keep the input voltage within the specified range. Also, ensure that the output voltage is set correctly using the feedback resistors, and that the device is operated within its specified temperature range.
  • The LTC2067IMS8#TRPBF can handle a maximum output current of 1.5A. However, it's recommended to derate the output current based on the ambient temperature and the device's thermal characteristics to ensure reliable operation.
  • The LTC2067IMS8#TRPBF has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, it's still recommended to add external protection circuitry, such as a voltage supervisor or a crowbar circuit, to ensure that the device is protected from voltage transients and faults.
  • The LTC2067IMS8#TRPBF has a thermal pad that should be connected to a solid ground plane or a thermal relief pattern on the PCB to dissipate heat. Additionally, ensure good airflow around the device, and consider using a heat sink or a thermal interface material (TIM) if the device is expected to operate at high temperatures or with high output currents.

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LTC2067IMS8#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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