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LTC3114IFE-1#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC3114IFE-1#PBF - DC-DC CONV, SYNC BUCK-BOOST, TSSOP-16

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LTC3114IFE-1#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm)_2020
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LTC3114IFE-1#PBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 16-Lead Plastic TSSOP (4.4mm)_2020
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LTC3114IFE-1#PBF Details

  • Manufacturer Part Number:

    LTC3114IFE-1#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1663 (BB)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 2.7V TO 40V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    2.2 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2.3 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    2.7 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Nom (Vsup):

    24 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    1400 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LTC3114IFE-1#PBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the VIN pin is 18V, but it's recommended to keep it below 15V for optimal performance and reliability.
  • To optimize the inductor selection, consider the inductor's saturation current, DC resistance, and core material. A good starting point is to choose an inductor with a saturation current rating above the peak current of the converter, and a DC resistance that minimizes losses.
  • The RUN pin is an active-high enable input that allows the user to turn the converter on and off. To use it, simply tie the RUN pin to VIN or a logic-level signal to enable the converter, or tie it to GND to disable it.
  • To configure the LTC3114 for a specific output voltage, use the FB pin and a resistive divider to set the output voltage. The FB pin is connected to the output voltage through a resistive divider, and the ratio of the resistors determines the output voltage.
  • The maximum output current that the LTC3114 can deliver is 2A, but it's recommended to derate the output current based on the input voltage, output voltage, and ambient temperature to ensure reliable operation.

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LTC3114IFE-1#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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