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LTC3115HFE-1#TRPBF - Analog Devices

Description: Switching Voltage Regulators 40Vin, 2A Sync. Buck-Boost Converter

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LTC3115HFE-1#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - FE Package 20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation CA
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LTC3115HFE-1#TRPBF - Analog Devices  - 3D model - Small Outline Packages - FE Package 20-Lead Plastic TSSOP (4.4mm) (Reference LTC DWG # 05-08-1663 Rev L) Exposed Pad Variation CA
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LTC3115HFE-1#TRPBF Details

  • Manufacturer Part Number:

    LTC3115HFE-1#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    05-08-1663 (CA)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 2.7 TO 40V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    2 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    2.7 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    2000 kHz

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LTC3115HFE-1#TRPBF Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the VIN pin is 40V, but it's recommended to keep it below 36V for reliable operation.
  • To optimize the inductor selection, consider the maximum output current, switching frequency, and core material. A good starting point is to use an inductor with a value between 1.5uH to 3.3uH, and a saturation current rating above the maximum output current.
  • To minimize EMI and noise, keep the switching node (SW pin) away from sensitive analog nodes, use a solid ground plane, and place the input and output capacitors close to the IC. Also, use a shielded inductor and orient it to minimize radiation.
  • To configure the LTC3115HFE-1 for a specific output voltage, connect a resistive divider from the output voltage to the FB pin, and calculate the resistor values using the formula provided in the datasheet. The output voltage can be set between 0.8V to 15V.
  • The thermal derating for the LTC3115HFE-1 is 30mW/°C above 70°C. To calculate the thermal derating, use the formula provided in the datasheet, which takes into account the junction temperature, ambient temperature, and power dissipation.

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LTC3115HFE-1#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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