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LTC3246HMSE#PBF - Analog Devices

Description: Switching Voltage Regulators Wide Vin Range Buck-Boost Charge Pump with Watchdog Timer

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LTC3246HMSE#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC3246HMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad
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LTC3246HMSE#PBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad
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LTC3246HMSE#PBF Details

  • Manufacturer Part Number:

    LTC3246HMSE#PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHED CAPACITOR CONVERTER

  • Control Mode:

    VOLTAGE-MODE

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    5 V

  • Output Voltage-Min:

    2.5 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3246HMSE#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC3246HMSE involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce noise and EMI. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To optimize the performance of the LTC3246HMSE in a high-temperature environment, ensure good thermal conduction by using a heat sink or a thermal pad, and follow the recommended operating conditions and derating guidelines. Additionally, consider using a thermally-enhanced package or a device with a higher temperature rating.
  • Potential failure modes of the LTC3246HMSE include overvoltage, undervoltage, overcurrent, and overheating. To mitigate these, ensure proper input and output voltage regulation, use overcurrent protection, and follow the recommended operating conditions and thermal management guidelines.
  • Yes, the LTC3246HMSE can be used in a battery-powered application. To optimize its performance, consider using a low-input-voltage regulator, optimizing the output voltage and current, and using power-saving modes such as shutdown or low-power standby.
  • To troubleshoot issues with the LTC3246HMSE, follow a systematic approach: check the input voltage, output voltage, and current; verify the component values and PCB layout; check for thermal issues; and consult the datasheet and application notes for guidance.

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LTC3246HMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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