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LTC3256EMSE#PBF - Analog Devices

Description: Switching Controllers Wide VIN Range Dual Output 350mA Step-Down Charge Pump with Watchdog Timer

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LTC3256EMSE#PBF - Analog Devices - PCB symbol
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LTC3256EMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad
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LTC3256EMSE#PBF - Analog Devices - 3D model - Small Outline Packages - MSE Package 16-Lead Plastic MSOP, Exposed Die Pad
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LTC3256EMSE#PBF Details

  • Manufacturer Part Number:

    LTC3256EMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    IT ALSO HAS 5V OUTPUT

  • Analog IC - Other Type:

    SWITCHED CAPACITOR CONVERTER

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    5.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.35 A

  • Output Voltage-Max:

    5.19 V

  • Output Voltage-Min:

    4.85 V

  • Output Voltage-Nom:

    5.05 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LTC3256EMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3256EMSE involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing trace lengths and widths to reduce EMI and noise. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure the LTC3256EMSE operates within its thermal limits, make sure to provide adequate heat sinking, such as a thermal pad or a heat sink, and keep the ambient temperature within the recommended operating range. Also, avoid high power dissipation and high ambient temperatures.
  • The recommended input capacitor type for the LTC3256EMSE is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric, with a value of 10uF to 22uF. This helps to filter out noise and ensure stable operation.
  • To troubleshoot issues with the LTC3256EMSE, start by checking the input voltage, output voltage, and current draw. Verify that the input and output capacitors are properly connected and of the recommended type and value. Also, check for any signs of overheating or physical damage to the IC or surrounding components.
  • Yes, the LTC3256EMSE is suitable for high-reliability and high-temperature applications, such as automotive, industrial, or aerospace systems. However, it's essential to follow the recommended operating conditions, including temperature range and power dissipation, to ensure reliable operation.

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LTC3256EMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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