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LTC3290EMSE#PBF - Analog Devices

Description: 10-Lead Plastic MSOP, Exposed Die Pad

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LTC3290EMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)
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LTC3290EMSE#PBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1664 Rev I)
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LTC3290EMSE#PBF Details

  • Manufacturer Part Number:

    LTC3290EMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-08-06

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    55 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LTC3290EMSE#PBF Frequently Asked Questions (FAQs)

  • The recommended layout and placement for the LTC3290EMSE can be found in the application note AN136, which provides guidelines for PCB layout, component placement, and thermal management to ensure optimal performance and minimize noise.
  • To optimize the output voltage accuracy of the LTC3290EMSE, ensure that the input voltage is within the recommended range, use a high-accuracy voltage reference, and minimize noise and ripple on the input and output lines. Additionally, consider using a Kelvin connection for the output voltage sense lines to reduce errors due to PCB trace resistance.
  • The maximum output current capability of the LTC3290EMSE is 2A, but this can be limited by the thermal performance of the device and the PCB. Ensure that the device is properly heatsinked and that the PCB is designed to handle the maximum output current to avoid overheating and reduce reliability.
  • To protect the LTC3290EMSE from overvoltage and undervoltage conditions, use a voltage supervisor or a reset IC to monitor the input voltage and shut down the device if it exceeds the recommended operating range. Additionally, consider using a TVS diode or a zener diode to clamp the input voltage and prevent damage from voltage spikes or surges.
  • The recommended input capacitor value and type for the LTC3290EMSE depend on the specific application and operating conditions. A general guideline is to use a low-ESR ceramic capacitor with a value of 10uF to 22uF, but this may need to be adjusted based on the input voltage ripple and noise requirements.

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LTC3290EMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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