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LTC3290IMSE#PBF - Analog Devices

Description: Switching Voltage Regulators High Voltage Boost Charge Pump

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LTC3290IMSE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad_2023
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LTC3290IMSE#PBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 10-Lead Plastic MSOP, Exposed Die Pad_2023
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LTC3290IMSE#PBF Details

  • Manufacturer Part Number:

    LTC3290IMSE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Date Of Intro:

    2019-08-06

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Control Technique:

    BURST MODE

  • Input Voltage-Max:

    55 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

LTC3290IMSE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3290 involves keeping the input and output capacitors close to the device, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Additionally, ensure that the input and output capacitors are of high quality and have low ESR. Also, avoid using long traces or wires for the feedback loop, and keep the feedback resistors close to the device.
  • The maximum input voltage that can be applied to the LTC3290 is 15V. Exceeding this voltage can cause damage to the device. It's recommended to add input voltage protection, such as a voltage clamp or a TVS diode, to prevent overvoltage conditions.
  • The LTC3290 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's output current and voltage at high temperatures, and to ensure good thermal management, such as using a heat sink or a thermally conductive PCB material.
  • To troubleshoot issues with the LTC3290, start by verifying the input voltage, output voltage, and output current. Check the PCB layout and component values to ensure they match the recommended values. Use an oscilloscope to check for oscillations or noise on the output. Also, check for any signs of overheating or physical damage to the device.

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LTC3290IMSE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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