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LTC3307AEV#TRPBF - Analog Devices

Description: 5V, 3A Synchronous Step-Down Silent Switcher in 2mm × 2mm LQFN and 1.6mm x 1.6mm WLCSP

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LTC3307AEV#TRPBF Details

  • Manufacturer Part Number:

    LTC3307AEV#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFN-12

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1530

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    SILENT SWITCHER

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.25 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-XQCC-N12

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    3 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.5 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC12,.08SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.83 mm

  • Supply Current-Max (Isup):

    2 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    3000 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Gold (Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

LTC3307AEV#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3307AEV involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the input and output traces. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input and output capacitors are of high quality and have low ESR. Additionally, avoid using long input and output traces, and keep the feedback resistors close to the IC.
  • The maximum ambient temperature range for the LTC3307AEV is -40°C to 125°C. However, the junction temperature should not exceed 150°C.
  • Yes, the LTC3307AEV is suitable for high-reliability applications. It is manufactured using a high-reliability process and is screened to ensure high reliability. However, it is essential to follow proper design and manufacturing practices to ensure the reliability of the final product.
  • To troubleshoot issues with the LTC3307AEV, start by checking the input and output voltages, and ensure that the input and output capacitors are properly connected. Check for any signs of overheating, and verify that the feedback resistors are correctly connected. If the issue persists, consult the datasheet and application notes for further guidance.

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LTC3307AEV#TRPBF Overview

Use the download button to access the LTC3307AEV#TRPBF schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like LTC33, or try a keyword search, such as Switching Regulator or Controllers

About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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