LTC3779HFE#TRPBF footprint, schematic symbol and 3D model by Analog Devices

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PCB Footprints

LTC3779HFE#TRPBF - Analog Devices PCB footprint - Other - Other - FE Package Package Variation: FE38 (31) 38-Lead Plastic TSSOP (4.4mm)_2025-1

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Part Number LTC3779HFE#TRPBF
Manufacturer Analog Devices
Pin Count 32
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - FE Package Package Variation: FE38 (31) 38-Lead Plastic TSSOP (4.4mm)_2025-1
Released Date Feb 2, 2025
Last Modified Date Nov 20, 2025 5:19 AM UTC
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LTC3779HFE#TRPBF Details

Manufacturer Part Number:
LTC3779HFE#TRPBF
Brand Name:
Analog Devices Inc
Pbfree Code:
No
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
TSSOP-38
Pin Count:
31
Manufacturer Package Code:
05-08-1865
Country Of Origin:
Thailand
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
Analog Devices Inc
YTEOL:
9
Additional Feature:
VOUT=(1.2-150 VOLT)
Analog IC - Other Type:
SWITCHING CONTROLLER
Control Mode:
CURRENT-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
150 V
Input Voltage-Min:
4.5 V
Input Voltage-Nom:
15 V
JESD-30 Code:
R-PDSO-G38
JESD-609 Code:
e3
Length:
9.7 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
38
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-40 °C
Output Voltage-Max:
150 V
Output Voltage-Min:
1.2 V
Package Body Material:
PLASTIC/EPOXY
Package Code:
HTSSOP
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Seated Height-Max:
1.2 mm
Surface Mount:
YES
Switcher Configuration:
BUCK-BOOST
Switching Frequency-Max:
550 kHz
Technology:
CMOS
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.5 mm
Terminal Position:
DUAL
Width:
4.4 mm

LTC3779HFE#TRPBF Frequently Asked Questions (FAQs)

A good PCB layout for the LTC3779HFE involves keeping the high-frequency switching nodes (e.g., SW, VIN, and VOUT) away from sensitive analog nodes, using a solid ground plane, and minimizing trace lengths and widths to reduce parasitic inductance and capacitance. A 4-layer board with a dedicated power plane and a solid ground plane is recommended.
When selecting an inductor for the LTC3779HFE, consider the inductor's saturation current, DC resistance, and core material. A good starting point is to choose an inductor with a saturation current rating of at least 1.5 times the maximum output current, a DC resistance of less than 100 mΩ, and a core material with low core loss (e.g., ferrite or powdered iron).
The LTC3779HFE is rated for operation from -40°C to 125°C ambient temperature. However, the device's performance and reliability may degrade at extreme temperatures. It's essential to ensure proper thermal management and consider derating the device's performance at high temperatures.
Yes, the LTC3779HFE is suitable for high-reliability and automotive applications. It's manufactured using a high-reliability process, and its performance is guaranteed over the -40°C to 125°C temperature range. However, it's essential to follow proper design and qualification procedures to ensure the device meets the specific requirements of your application.
To troubleshoot issues with the LTC3779HFE, start by verifying the PCB layout and component selection. Check for proper decoupling, filtering, and grounding. Use an oscilloscope to monitor the device's switching nodes and output voltage. Consult the datasheet and application notes for guidance on troubleshooting common issues, and consider seeking support from Analog Devices' technical support team if needed.

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LTC3779HFE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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