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LTC3779IFE#PBF - Analog Devices

Description: Switching Controllers 150V VIN & VOUT Sync 4-Switch Buck-Boost

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LTC3779IFE#PBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - 38 lead tssop
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LTC3779IFE#PBF - Analog Devices  - 3D model - Small Outline Packages - 38 lead tssop
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LTC3779IFE#PBF Details

  • Manufacturer Part Number:

    LTC3779IFE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-38

  • Pin Count:

    31

  • Manufacturer Package Code:

    05-08-1865

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Additional Feature:

    VOUT=(1.2-150 VOLT)

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    150 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    150 V

  • Output Voltage-Min:

    1.2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    550 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

LTC3779IFE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3779IFE involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input capacitors close to the IC. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • When choosing an inductor for the LTC3779IFE, consider the inductor's saturation current, DC resistance, and core material. A good starting point is to choose an inductor with a saturation current rating of at least 1.5 times the maximum output current, and a DC resistance of less than 100 mΩ.
  • The LTC3779IFE is rated for operation from -40°C to 125°C, but the maximum ambient temperature range depends on the specific application and the device's power dissipation. In general, the device can operate up to 85°C ambient temperature with proper heat sinking and airflow.
  • To troubleshoot issues with the LTC3779IFE, start by checking the input voltage, output voltage, and current sense resistor values. Verify that the component values and PCB layout are correct, and check for signs of overheating or physical damage. Use an oscilloscope to observe the output voltage and current waveforms, and consult the datasheet and application notes for guidance.
  • Yes, the LTC3779IFE is suitable for high-reliability and automotive applications. It is AEC-Q100 qualified and meets the requirements for automotive and industrial applications. However, additional testing and validation may be required to ensure compliance with specific industry standards.

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LTC3779IFE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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