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LTC3822EMSE#TRPBF - Analog Devices

Description: Buck Regulator Positive Output Step-Down DC-DC Controller IC 10-MSOP-EP 300kHz, 550kHz, 750kHz 2.75V ~ 4.5V

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LTC3822EMSE#TRPBF Details

  • Manufacturer Part Number:

    LTC3822EMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, PLASTIC, MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    05-08-1664

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    CONSTANT FREQUENCY

  • Input Voltage-Max:

    4.5 V

  • Input Voltage-Min:

    2.75 V

  • Input Voltage-Nom:

    3.3 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    850 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3822EMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3822EMSE involves keeping the high current paths short and wide, using multiple vias to connect the GND pins to the ground plane, and placing the input capacitors close to the VIN pin. A 4-layer board with a dedicated ground plane is recommended. Refer to the LTC3822 demo board layout for a reference design.
  • The compensation network for the LTC3822EMSE involves selecting the right values for the RC network connected to the COMP pin. A good starting point is to use the values recommended in the datasheet, and then adjust them based on the specific application requirements. The goal is to achieve a stable loop with adequate phase margin. Refer to the LTC3822 application note AN140 for more details.
  • The maximum ambient temperature for the LTC3822EMSE is 85°C, but the device can operate up to 125°C with derating. Refer to the datasheet for the thermal derating curve to determine the maximum power dissipation at a given ambient temperature.
  • Yes, the LTC3822EMSE is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard for automotive applications and is manufactured using a qualified process. However, additional testing and validation may be required for specific applications.
  • To protect the LTC3822EMSE from input voltage transients, use a TVS diode or a transient voltage suppressor in parallel with the input capacitors. This will help to clamp the input voltage and prevent damage to the device. Additionally, consider using a fuse or a current limiter to protect against overcurrent conditions.

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LTC3822EMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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