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LTC3851EMSE#TRPBF - Analog Devices

Description: Synchronous Step-Down Switching Regulator Controller

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LTC3851EMSE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - MSE Package 16--Lead Plastic MSOP, Exposed Die Pad
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LTC3851EMSE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - MSE Package 16--Lead Plastic MSOP, Exposed Die Pad
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LTC3851EMSE#TRPBF Details

  • Manufacturer Part Number:

    LTC3851EMSE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1667

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    4 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    4.039 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.05 A

  • Output Voltage-Max:

    5.5 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    TSSOP16,.19,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    790 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3851EMSE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3851EMSE involves keeping the input and output capacitors close to the IC, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • The input capacitor should be a low-ESR ceramic capacitor with a value between 10uF to 22uF, and the output capacitor should be a low-ESR ceramic capacitor with a value between 22uF to 47uF. The capacitor values and types should be chosen based on the specific application requirements and the output voltage ripple and noise requirements.
  • The maximum ambient temperature range for the LTC3851EMSE is -40°C to 125°C. However, the junction temperature should not exceed 150°C to ensure reliable operation.
  • The switching frequency of the LTC3851EMSE can be programmed using an external resistor connected between the RT pin and the GND pin. The switching frequency can be calculated using the formula provided in the datasheet.
  • The maximum output current capability of the LTC3851EMSE is 1.5A. However, the output current should be derated based on the ambient temperature and the input voltage to ensure reliable operation.

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LTC3851EMSE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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