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LTC3859ALHFE#TRPBF - Analog Devices

Description: Triple Output, Buck/Buck/Boost Synchronous Controller with 28?A Burst Mode IQ

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LTC3859ALHFE#TRPBF - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP W/ THERMAL PAD_2023-1
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LTC3859ALHFE#TRPBF - Analog Devices  - 3D model - Small Outline Packages - TSSOP W/ THERMAL PAD_2023-1
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LTC3859ALHFE#TRPBF Details

  • Manufacturer Part Number:

    LTC3859ALHFE#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-38

  • Pin Count:

    38

  • Manufacturer Package Code:

    05-08-1772

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OUTPUT VOLTAGE RANGE FROM 0.8 VOLT TO 24 VOLT

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G38

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    38

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    900 kHz

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

LTC3859ALHFE#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3859ALHFE involves keeping the high-current paths short and wide, using multiple vias to connect the GND pins to the ground plane, and placing the input capacitors close to the VIN pin. A 4-layer board with a solid ground plane is recommended. Refer to the datasheet's layout guidelines and application notes for more details.
  • To select the right inductor for the LTC3859ALHFE, consider the maximum output current, switching frequency, and desired ripple current. A good starting point is to use an inductor with a saturation current rating of at least 1.5 times the maximum output current. The datasheet provides a list of recommended inductors and a calculation method to determine the optimal inductor value.
  • The maximum junction temperature for the LTC3859ALHFE is 125°C. However, it's recommended to keep the junction temperature below 100°C for optimal performance and reliability. The datasheet provides a thermal derating curve to help estimate the maximum ambient temperature for a given power dissipation.
  • While the LTC3859ALHFE can operate up to 125°C, it's not recommended for high-temperature environments above 85°C without proper derating and thermal management. The device's performance and reliability may degrade at high temperatures, and the maximum output current may need to be reduced. Consult the datasheet and application notes for more information.
  • To troubleshoot issues with the LTC3859ALHFE, start by checking the input voltage, output voltage, and output current. Verify that the device is properly configured and that the input and output capacitors are suitable. Use an oscilloscope to check for switching noise, ringing, and voltage overshoot. Consult the datasheet's troubleshooting section and application notes for more guidance.

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LTC3859ALHFE#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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