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LTC3863HDE#PBF - Analog Devices

Description: Switching Voltage Regulators 60V Low IQ Inverting Buck-Boost DC/DC PMOS Controller

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LTC3863HDE#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - 12-Lead Plastic DFN
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LTC3863HDE#PBF - Analog Devices  - 3D model - Small Outline No-lead - 12-Lead Plastic DFN
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LTC3863HDE#PBF Details

  • Manufacturer Part Number:

    LTC3863HDE#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    12

  • Manufacturer Package Code:

    05-08-1695

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Additional Feature:

    OPERATES IN ADJUSTABLE OUTPUT MODE FROM -0.4V TO -150V

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    60 V

  • Input Voltage-Min:

    3.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-N12

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    850 kHz

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

LTC3863HDE#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC3863HDE involves keeping the high-current paths short and wide, using a solid ground plane, and placing the input and output capacitors close to the IC. A 4-layer board with a dedicated power plane is recommended. Refer to the datasheet's layout guidelines and application notes for more details.
  • Choose input capacitors with low ESR and high ripple current rating. Output capacitors should have low ESR, high capacitance, and be able to handle the output voltage and current. Consider using ceramic or polymer capacitors. Refer to the datasheet's capacitor selection guidelines and application notes for more details.
  • The maximum ambient temperature for the LTC3863HDE is 85°C. However, the junction temperature (TJ) should not exceed 125°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.
  • Yes, the LTC3863HDE is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is manufactured with a controlled process flow. However, additional testing and validation may be required for specific applications. Consult with Analog Devices' support team for more information.
  • Start by checking the PCB layout, component selection, and soldering quality. Ensure that the input and output capacitors are properly selected and placed. Use an oscilloscope to measure the input and output waveforms, and check for signs of oscillation or instability. Consult the datasheet's troubleshooting section and application notes for more guidance.

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LTC3863HDE#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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