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LTC4270BIUKG#PBF - Analog Devices

Description: LINEAR TECHNOLOGY - LTC4270BIUKG#PBF - PSE, CNTRL, 12 PORT, 25.5W, 1MHZ, 24QFN

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LTC4270BIUKG#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC4270BIUKG#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UKG Package 52-Lead Plastic QFN (7mm × 8mm)-1
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3D Models
LTC4270BIUKG#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UKG Package 52-Lead Plastic QFN (7mm × 8mm)-1
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LTC4270BIUKG#PBF Details

  • Manufacturer Part Number:

    LTC4270BIUKG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-52

  • Pin Count:

    52

  • Manufacturer Package Code:

    05-08-1729

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • JESD-30 Code:

    R-PQCC-N52

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    52

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC52,.27X.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    57 V

  • Supply Voltage-Min:

    45 V

  • Supply Voltage-Nom:

    54 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    PSE CONTROLLER

LTC4270BIUKG#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4270 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a separate analog and digital ground plane to minimize noise coupling.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, which is to apply VCC first, followed by VIO. Also, make sure to configure the device correctly by setting the correct voltage levels on the EN and SEL pins, and ensuring that the input and output capacitors are properly connected.
  • The LTC4270 has a maximum junction temperature of 125°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and keep the device away from other heat sources. Also, follow the recommended PCB layout guidelines to minimize thermal resistance.
  • To troubleshoot issues with the LTC4270, start by checking the input and output voltage levels, and ensure that the device is properly powered up and configured. Check for any signs of overheating, and verify that the input and output capacitors are properly connected. If the issue persists, consult the datasheet and application notes for further guidance.
  • The LTC4270 is a commercial-grade device, but it can be used in high-reliability or high-temperature applications with proper design and testing. However, it's recommended to consult with Analog Devices Inc. for specific guidance and to evaluate the device's performance under the desired operating conditions.

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LTC4270BIUKG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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