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LTC4270CIUKG#PBF - Analog Devices

Description: IC POE CNTRL 12 CHANNEL 52QFN

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LTC4270CIUKG#PBF - Analog Devices - PCB symbol
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PCB Footprints
LTC4270CIUKG#PBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UKG Package 52-Lead Plastic QFN (7mm × 8mm)-1
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3D Models
LTC4270CIUKG#PBF - Analog Devices - 3D model - Quad Flat No-Lead - UKG Package 52-Lead Plastic QFN (7mm × 8mm)-1
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LTC4270CIUKG#PBF Details

  • Manufacturer Part Number:

    LTC4270CIUKG#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-52

  • Pin Count:

    52

  • Manufacturer Package Code:

    05-08-1729

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • JESD-30 Code:

    R-PQCC-N52

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    52

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC52,.27X.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max:

    57 V

  • Supply Voltage-Min:

    45 V

  • Supply Voltage-Nom:

    54 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    PSE CONTROLLER

LTC4270CIUKG#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LTC4270 involves keeping the input and output traces short and wide, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a separate analog and digital ground plane to minimize noise coupling.
  • To ensure proper power-up and configuration, follow the recommended power-up sequence, which is to apply VCC first, followed by VIO. Also, make sure to configure the device correctly by setting the correct voltage levels on the EN and SEL pins, and by programming the device using the I2C interface.
  • The LTC4270 has a maximum junction temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and to keep the device within the recommended operating temperature range. A thermal pad on the bottom of the package can be used to improve heat dissipation.
  • To troubleshoot issues with the LTC4270, start by verifying the power supply and configuration. Check the voltage levels on the EN and SEL pins, and ensure that the I2C interface is functioning correctly. Use a logic analyzer or oscilloscope to monitor the I2C bus and verify that the device is receiving the correct commands. Also, check for any signs of overheating or electrical overstress.
  • To minimize EMI and EMC issues, use a shielded enclosure, and ensure that the PCB layout is designed to minimize radiation. Use a common-mode choke or ferrite bead on the input and output lines to reduce EMI. Additionally, follow proper PCB design practices, such as using a solid ground plane and minimizing loop areas.

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LTC4270CIUKG#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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