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LTC6082CDHC#PBF - Analog Devices

Description: Precision Amplifiers Prec 4x CMOS R2R In/Out Amps

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PCB Footprints
LTC6082CDHC#PBF - Analog Devices PCB footprint - Small Outline No-lead - Small Outline No-lead - DHC Package 16-Lead Plastic DFN (5mm × 3mm) (Reference LTC DWG # 05-08-1706 Rev Ø)
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3D Models
LTC6082CDHC#PBF - Analog Devices  - 3D model - Small Outline No-lead - DHC Package 16-Lead Plastic DFN (5mm × 3mm) (Reference LTC DWG # 05-08-1706 Rev Ø)
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LTC6082CDHC#PBF Details

  • Manufacturer Part Number:

    LTC6082CDHC#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    05-08-1706

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00004 µA

  • Common-mode Reject Ratio-Min:

    88 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    90 µV

  • JESD-30 Code:

    R-PDSO-N16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC16,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.8 mm

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    1.74 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    3600

  • Voltage Gain-Min:

    316227.76

  • Wideband:

    YES

  • Width:

    3 mm

LTC6082CDHC#PBF Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LTC6082CDHC#PBF is 1.4W, which is dependent on the ambient temperature and the thermal resistance of the package.
  • To optimize the layout, keep the input and output traces short and separate, use a solid ground plane, and place the device close to the power supply bypass capacitors. Additionally, use a shielded inductor and orient it to minimize radiation.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. The capacitor should be placed close to the VIN pin and the power supply bypass capacitors.
  • To ensure stability, follow the recommended layout and component selection guidelines, and make sure the output capacitor is properly sized and placed. Additionally, add a small capacitor (e.g., 10nF) between the VFB pin and GND to improve stability.
  • The maximum output current capability of the LTC6082CDHC#PBF is 2A, but it can be limited by the thermal performance of the package and the ambient temperature.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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